Advanced LED Packaging
Our DIP LED production line integrates the latest ASM automatic crystalline machines and wire bonders.
ISO 9001
RoHS Compliant
01. Precision Bonding
Utilizing 99.99% high-purity gold wire for chip-to-lead connections, ensuring superior thermal stability and electrical conductivity.
02. Vacuum Encapsulation
Automated epoxy dispensing in a vacuum environment eliminates air bubbles, ensuring 100% optical clarity and lens uniformity.
03. 72h Burn-in Test
Every batch of LED lamp beads undergoes high-temperature aging tests to filter out early-stage failures and guarantee lifespan.